Page 63 - 《真空与低温》2025年第4期

真空与低温 第 31 卷 第 4 期
478 Vacuum and Cryogenics 2025 年 7 月

Cu/ITO/PET 柔 性 薄 膜 的 制 备 和 弯 曲 性 能 研 究

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徐壮壮 ，王国栋 ，束民涛 ，姚吉恺 ，朱 磊 ，周 健 ，张继凡 ，张石亮 2
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（1. 合肥工业大学 机械工程学院，合肥 230009；
2. 安徽立光电子材料股份有限公司，安徽 滁州 239299）
摘要：采用磁控溅射法制备了 Cu/ITO/PET 柔性薄膜，并搭建了力学测试装置，对薄膜进行了弯曲和循环弯曲
实验。使用四探针测试仪测试了不同工况下薄膜的方阻变化，通过扫描电子显微镜（SEM）观察了薄膜弯曲前后的
表面形貌。结果表明，弯曲过程中，随着弯曲半径减小到 7 mm，薄膜在内弯曲模式下的方阻发生显著变化。弯曲
半径减小到 3 mm 时，薄膜在外弯曲模式下产生的裂纹比内弯曲更明显，方阻更大。弯曲半径为 9 mm 时，经过 1 500 次
循环弯曲，薄膜在内弯曲模式下产生了细微的裂纹，在外弯曲模式下没有观察到裂纹，内弯曲模式比外弯曲模式
下的方阻更大。内弯曲半径和外弯曲半径从 9 mm 减小到 3 mm 时，薄膜方阻相对变化率在 8% 以内。内、外弯曲
半径均固定为 9 mm 时，经过 6 组弯曲实验，薄膜方阻相对变化率均在 6% 以内。制备的柔性薄膜具有良好的导电
和耐弯曲性能。
关键词：磁控溅射；Cu/ITO/PET；方块电阻；耐弯曲性能
中图分类号：TB79 文献标志码：A 文章编号：1006−7086（2025）04−0478−05
DOI：10.12446/j.issn.1006-7086.2025.04.008

Preparation and Bending Properties of Cu/ITO/PET Flexible Films

XU Zhuangzhuang ，WANG Guodong ，SHU Mintao ，YAO Jikai ，ZHU Lei ，ZHOU Jian ，
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ZHANG Jifan ，ZHANG Shiliang
（1. School of Mechanical Engineering，Hefei University of Technology，Hefei 230009，China；
2. Anhui Liguang Electronic Material Co.，Ltd.，Chuzhou 239299，Anhui，China）
Abstract：Cu/ITO/PET flexible films were fabricated using magnetron sputtering，and a mechanical testing device was
set up to conduct bending and cyclic bending experiments on the films. The sheet resistance variations of the films under dif-
ferent bending conditions were measured by a four-probe tester，and the surface morphologies of the films before and after
bending were observed via scanning electron microscopy （SEM）. The experimental results reveal the following： During the
bending process，as the bending radius decreases to 7 mm，the sheet resistance of the film changed significantly under the in-
ner bending mode. When the bending radius is further reduced to 3 mm，more obvious cracks form on the film surface under
the outer bending mode compared with the inner bending mode，resulting in a larger sheet resistance. At a bending radius of
9 mm，after 1 500 cycles of cyclic bending，subtle cracks appear in the film under the inner bending mode，while no cracks
are observed under the outer bending mode. Notably，the sheet resistance under the inner bending mode is larger than that under
the outer bending mode. When the inner and outer bending radii decrease from 9 mm to 3 mm，the relative variation rate of
the sheet resistance remains within 8%. When both the inner and outer bending radii are fixed at 9 mm，after six groups of
bending experiments，the relative variation rate of the sheet resistance is within 6% for all groups. Overall，the prepared flexi-
ble films exhibit excellent electrical conductivity and bending resistance，demonstrating their potential applications in flexi-
ble electronic devices requiring mechanical flexibility and stable electrical performance. The comprehensive analysis of sheet
resistance variations and surface morphologies under different bending conditions provides a theoretical basis for the design
and optimization of flexible conductive films in practical engineering applications.
Key words：sputter；Cu/ITO/PET；sheet resistance；bending resistance

收稿日期：2024−12−28
基金项目：安徽立光电子校企合作项目（W2021JSKF0644）
作者简介：徐壮壮，硕士研究生。E-mail：1509313566@qq.com
通信作者：王国栋，博士，副教授。E-mail： gdwang@hfut.edu.cn