Page 68 - 《真空与低温》2025年第4期

第 31 卷 第 4 期 真空与低温
2025 年 7 月 Vacuum and Cryogenics 483

密 封 器 件 中 的 水 汽 含 量 计 算 及 修 正

肖汉武，张顺亮
（无锡中微高科电子有限公司，江苏 无锡 214035）

摘要：体积分数 0.5% 是 GJB548 中关于气密封装器件内部气体中水汽含量的接收判据。由于气密封装器件
内部气体压力通常低于 101.325 kPa（1 个标准大气压），内部水汽测试中的实际测量值并不能反映器件的真实水汽
压力。讨论了封装器件内部水汽含量测量值与封装内部气体压力之间的关系，通过理论计算提出了一种水汽含
量测试结果的修正方法。该方法对推算器件的实际露点温度具有指导意义。
关键词：密封器件；水汽含量；露点；封装内部初始总气压
中图分类号：TB79 文献标志码：A 文章编号：1006−7086（2025）04−0483−06
DOI：10.12446/j.issn.1006-7086.2025.04.009

Calculation and Correction on Water Vapor Content Value in Sealing Devices

XIAO Hanwu，ZHANG Shunliang
（Wuxi ZhongWei High-tech Electronics Co.，Ltd.，Wuxi 214035，Jiangsu，China）

Abstract：The volume fraction 0.5% is the acceptance criterion of water vapor content in the internal atmosphere of her-
metic sealing devices according to the GJB548 standard. It is based on the assumption that the gas pressure inside a hermetic
sealing device is one standard atmospheric pressure. However，the hermetic packaging achieved by current sealing process
technologies typically results in an internal gas pressure that is always less than 1 standard atmospheric pressure. The higher
the sealing process temperature，the lower the total internal gas pressure of the device. Taking the three most common her-
metic sealing processes-parallel seam welding，gold tin alloy solder sealing，and low temperature glass frit sealing- as exam-
ples，devices sealed by parallel seam welding exhibit the highest internal gas pressure，which is around 0.8 standard atmo-
spheric pressure. Devices sealed with gold tin alloy solder sealing have an internal gas pressure of around 0.6 standard atmo-
spheric pressure，while those sealed with low temperature glass frit sealing show the lowest internal gas pressure of around
0.4 standard atmospheric pressure. That means the actual measured values in the internal water vapor content test could not
represent the real water vapor pressure inside the device because the dew point temperature corresponding to a water vapor
content of 0.5% is significantly below zero degrees Celsius. This paper discusses the relationship between measured water va-
por content values and the internal gas pressure of hermetic sealing devices. Through theoretical calculations， a correction
method for water vapor content test results is proposed，which shows when the actual dew point temperature is zero degrees
Celsius，the corresponding internal water vapor content levels for devices using parallel seam welding，gold tin alloy solder-
ing and low temperature glass frit sealing are 0.748 7%，1.123 4% and 1.341 0%，respectively. These values are all larger than 0.5%.
Key words：hermetic sealing devices；water vapor content；dew point；initial total gas pressure inside the package

0 引言 汽凝结成液态水膜后（即形成结露），绝缘电阻迅速
对于高可靠微电子器件而言，除封装气密性外， 下降，并成为腐蚀介质及通道。呈现气态的水对器
封装腔体内部的水汽含量是密封器件可靠性试验 件的影响较小，这也是器件在高温老练试验中很少
中另一个重要的技术指标。众所周知，密封器件中 出现因水汽超标而失效的原因。当封装内部水分
存在的水汽将会降低芯片相邻 I/O 间的绝缘电阻， 变成固态水即结冰后，绝缘电阻相对液态水增大，
使得漏电流增大，同时增加器件内部的腐蚀风险。 缺少液态的扩散作用对器件的腐蚀性也会变小，故
水汽的危害主要来自液态水，只有当封装内部的水 对器件的危害反而变小。

收稿日期：2025−01−23
作者简介：肖汉武，正高级工程师。E-mail：hwxiao0106@163.com