Page 33 - 《摩擦学学报》2020年第6期

第 40 卷 第 6 期 摩 擦 学 学 报 Vol 40 No 6
2020 年 11 月 Tribology Nov, 2020

DOI: 10.16078/j.tribology.2019255

CMP加工后芯片三维形貌表征参数体系

1,2*
1,2
1
黄静飞 , 任志英 , 罗德海 , 路纯红 3
(1. 福州大学 机械工程及自动化学院，福建 福州 350116;
2. 福州大学 金属橡胶工程研究中心，福建 福州 350116;
3. 河北工业职业技术学院 汽车工程系，河北 石家庄 050091)

摘 要: 针对当前化学机械抛光(chemical mechanical polishing, CMP)后的芯片表面形貌的表征常常只停留在研究二
维轮廓特征，无法完整地表达整个三维表面形貌信息，仅使用单一的评定指标来表征其表面的不平整程度等问题，
建立了1个科学、全面的芯片表面形貌评定参数体系应用于工程表面粗糙度评定中，通过分析芯片表面形貌的幅值
分布特征，结合芯片表面的统计特性，基于ISO 25178-2标准表征参数建立适用于芯片表面三维评定的表征参数体
系. 仿真结果表明：CMP加工后芯片表面形貌的幅值近似服从高斯分布；分形维数D可以准确表征芯片表面形貌，反
映其复杂程度；通过幅度参数、空间参数、混合参数和分形参数建立的芯片表面形貌评定体系能够从多方面表征芯
片三维表面形貌特征，对芯片表面形貌参数评定具有一定的可行性.
关键词: 化学机械抛光; 三维表面形貌; 表征参数; ISO 25178-2; 分形维数
中图分类号: TH161.14 文献标志码: A 文章编号: 1004-0595(2020)06–0716–10

Parameter System for Characterization of 3D Morphology of
Chip after CMP Processing

1,2*
1
1,2
HUANG Jingfei , REN Zhiying , LUO Dehai , LU Chunhong 3
(1. School of Mechanical Engineering and Automation, Fuzhou University, Fujian Fuzhou 350116, China
2. Engineering Research Center for Metal Rubber, Fuzhou University, Fujian Fuzhou 350116, China
3. Department of Automotive Engineering, Hebei College of Industry and Technology,
Hebei Shijiazhuang 050091, China)
Abstract: Deficiencies of the current characterization of the surface morphology of the chip after chemical mechanical
polishing, i.e. the two-dimensional contour features without the whole three-dimensional surface morphology
information, and the usage of a single evaluation index to characterize the surface roughness and other issues, a scientific
and comprehensive chip surface morphology evaluation parameter system was established and applied to the engineering
surface roughness evaluation. By analyzing the amplitude distribution characteristics of chip surface morphology
combined with the statistical characteristics of chip surface, a characterization parameter system suitable for chip surface
3D evaluation was established based on ISO 25178-2 standard characterization parameters. The simulation results
showed that the amplitude of chip surface topography after CMP processing approximately obeyed Gaussian
distribution. Fractal dimension D accurately characterized the surface morphology of the chip and reflected its

Received 19 December 2019, revised 7 March 2020, accepted 1 April 2020, available online 28 November 2020.
*Corresponding author. E-mail: renzyrose@126.com, Tel: +86-18960921872.
The project was supported by the National Natural Science Foundation of China (51805086/51975123)， the Natural Science
Foundation of Fujian Province, China (2019J01210) and the Fujian Province Health Education Joint Research Project, China(2019-
WJ-01).
国家自然科学基金项目(51805086/51975123)，福建省自然科学基金项目(2019J01210)和福建省卫生教育联合攻关计划项目
(2019-WJ-01)资助.