Page 15 - 《真空与低温》2025年第5期
P. 15

554                                         真空与低温                                   第 31 卷 第  5  期


              撑;热阴极辅助磁控溅射技术则可显著提高镀膜沉                                trial scale manufactured superlattice hard PVD coatings[J].
              积速率。                                                  Surface Engineering,2001,17(1):15−27.
                  展望未来,通过引入弧光放电增强磁控溅射等                          [17]   Robertson J. Diamond-like amorphous carbon[J]. Materials
              离子体密度,有望进一步克服沉积速率低、金属离                                Science & Engineering R Reports,2002,37(4/6):129−281.
              化率低、反应沉积工艺难度大等瓶颈,推动磁控溅                            [18]   薛群基,王立平. 类金刚石碳基薄膜材料 [M]. 北京:科学
              射镀膜技术在高新技术领域发挥更大作用。                                   出版社,2012.
                                                                [19]   杜军,何家文. 类石墨碳膜的制备及其与类金刚石碳膜的
              参考文献:
                                                                    区分  [J]. 中国表面工程,2005,18(4):6−8.
              [1]   王福贞,武俊伟. 现代离子镀膜技术        [M]. 北京:机械工业       [20]   付永辉,朱晓东,何家文,等. 非平衡磁控溅射沉积类石墨
                 出版社,2021.                                          膜及其摩擦磨损性能研究         [J]. 摩擦学学报,2003,23(6):
              [2]   WANG F Z,WU J W. Modern ion plating technology [M].  463−467.
                 New York:Elsevier,2022.                        [21]   王福贞. 一种磁控溅射镀膜机:201720302687.3[P]. 2017-
              [3]   王福贞,马文存. 气相沉积应用技术        [M]. 北京:机械工业           03-27.
                 出版社,2007.                                      [22]   王福贞. 一种磁控溅射镀膜机:201720302520.7 [P]. 2017-
              [4]   KELLY P J,ARNELL R D. Magnetron sputtering:A review  03-27.
                 of  recent  developments  and  applications[J].  Vacuum, 2000,  [23]   达道安. 真空设计手册  [M]. 第三版. 北京:国防工业出版

                 56(3):159−172.                                     社,2004:851.
              [5]   CHAPMAN  B.  Glow  discharge  processes  [M].  New  York:  [24]   王福贞. 一种设置气体弧光等离子体清洗源的镀膜机:
                 John Wiley & Sons Inc,1980.                        20182021443.4 [P]. 2018-02-07.
              [6]   DEPPLA  D, MAHIEU  S.  Reactive  sputter  deposition  [M].  [25]   姜燮昌. 大面积反应溅射技术的最新发展及应用  [J]. 真
                 Springer-Verlag Berlin Heidelberg,2008.            空,2002,39(3):1−9.
              [7]   MATTOX D M. Handbook of physical vapor deposition (PVD)  [26]   BELLIDO-GONZALEZ V,DANIEL B,COUNSELL J,et. al.
                 processing [M]. Elsevier Science New York,2010.    Flexible reactive gas sputtering process control[C]//47th An-
              [8]   FREY H,KHAN H R. Handbook of thin-film technology [M].  nual  Technical  Conference  Proceedings  of  the  Society  of
                 Springer Science New York,2015.                    Vacuum Coaters,2004.
              [9]   张以忱. 真空镀膜技术   [M]. 北京:冶金工业出版社,2009.         [27]   BRINDLEY  J, BELLIDO-GONZALEZ  V, DANIEL  B.
              [10]   田民波. 薄膜技术与薄膜材料      [M]. 北京:清华大学出版             Vacuum species sensing using remote plasma emission spe-
                  社,2011.                                           ctroscopy[EB/OL]. [2025-02-25]. http://www.gencoa.com/.
              [11]   WINDOW B,SAVVIDES N. Unbalanced DC magnetrons  [28]   SONG Y Z,SAKURAI T,MARUTA K,et al. Optical and
                  as sources of high ion fluxes[J]. Journal of Vaccum Science &  structural properties of dense SiO 2  ,Ta 2 O 5  and Nb 2 O 5  thin-
                  Technology A,1986,4(3):453−455.                   films  deposited  by  indirectly  reactive  sputtering  technique
              [12]   KOMATH M. Studies on the optimization of unbalanced ma-  [J]. Vacuum,2000,59(2):755−763.
                  gnetron sputtering cathode[J]. Vacuum,1999,52(3):307−  [29]   CHIBA S,MOTOKI A,FUJIKURA K,et al. Metal deposi-
                  331.                                              tion and oxygen-ion implantation for optical thin films[J].
              [13]   BROWN R,BELLIDO-GONZALEZ V. Comparison of ba-  Vacuum,2004,74(3):449−454.
                  lanced and unbalanced array designs [EB/OL]. [2025-02-25].  [30]   魏荣华. 等离子体增强磁控溅射  Ti-Si-C-N  基纳米复合膜
                  http//:www.gencoa.com.                            层耐冲蚀性能研究      [J]. 中国表面工程,2009,22(1):1−10.
              [14]   TEER D,TEER P. Deposition of material to form a coating:  [31]   李灿民,魏荣华. 等离子体增强磁控溅射沉积(TiAl)纳米
                  US 2012/0097528 A1 [P]. 2012-04-26.               复合涂层在铸铝模具上的应用           [J]. 中国表面工程,2012,
              [15]   BAI X Y,TONG Y S,SUN H L. Closed field unbalanced  25(2):1−7.
                  magnetron  sputter  ion  plating  technology  and  its  applica-  [32]   张鑫,王晓明,高键波. 靶电流密度对热丝增强等离子磁
                  tions in industry[Z]. Teer Company China Agent Company  控溅射制备  Cr 2 N  薄膜结构与性能的影响  [J]. 功能材料,
                  Product Brochure,2024.                            2018,49(3):3070−3075.
              [16]   MÜNZ W D,LEWIS D B,HOVSEPIAN P E,et al. Indus-  [33]   WEI R H,JAKAB M A,COULTER K,et al. Plasma sur-
   10   11   12   13   14   15   16   17   18   19   20