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第 40 卷     第 5 期                        摩  擦  学  学  报                                  Vol 40   No 5
            2020  年 9  月                                 Tribology                                   Sept, 2020


            DOI: 10.16078/j.tribology.2019230



                              纯铅化学机械抛光中工艺参数对

                                             抛光性能的影响




                                                               1*
                                                      1
                                                蔡  荣 , 余家欣 , 王  超       2
                                (1. 西南科技大学 制造过程测试技术教育部重点实验室,四川 绵阳 621010;
                                    2. 中国工程物理研究院 机械制造工艺研究所,四川 绵阳 621900)

                摘   要: 为获得高质量纯铅表面,采用化学机械抛光(CMP)的方法并辅以自制抛光液,研究了胶体二氧化硅抛光颗
                粒的形状、粒径和浓度、加载压力、抛光头与抛光盘转向和转速、抛光液流量等工艺参数对铅片表面材料去除率和
                粗糙度的影响. 研究表明:小粒径异形(眉形)胶体二氧化硅抛光颗粒相较于大粒径球形颗粒更有利于铅片抛光,抛
                光颗粒的粒径和浓度对纯铅抛光性能的影响主要取决于铅片表面与胶体二氧化硅颗粒以及抛光垫表面丝绒的耦合
                作用关系. 随着加载压力、抛光头与抛光盘转向和转速、抛光液流量的改变,铅片表面和抛光垫之间驻留的层间抛
                光液的厚度以及状态发生改变,从而直接影响抛光液的流动性、润滑性和分散性,以及影响抛光颗粒和化学试剂与
                铅片表面的机械化学作用,进而影响抛光质量和材料去除率. 通过对工艺参数影响的研究和对工艺参数的优化,最
                终获得了表面粗糙度R a 为1.5 nm的较为理想的超光滑纯铅表面,同时材料去除率能够达到适中的380 Å/min.
                关键词: 铅; 化学机械抛光; 工艺参数; 材料去除率; 表面粗糙度
                中图分类号: TH117.1                  文献标志码: A                   文章编号: 1004-0595(2020)05–0559–10


                     Effect of Process Parameters on Polishing Performance of

                          Pure Lead During Chemical Mechanical Polishing


                                                     1         1*            2
                                            CAI Rong , YU Jiaxin , WANG Chao
                       (1. Key Laboratory of Testing Technology for Manufacturing Process, Ministry of Education, Southwest
                                  University of Science and Technology, Sichuan Mianyang 621010, China
                          2. Institute of Mechanical Manufacturing Technology, China Academy of Engineering Physics,
                                                Sichuan Mianyang 621900, China)
                 Abstract: In order to obtain high-quality pure lead surface, based on self-made polishing slurries, the influence of shape,
                 particle size and concentration of colloidal silica polishing particles, as well as down force, the rotation speed and
                 direction of polishing head / disc and the slurry flow rate on the surface material removal rate and roughness of lead
                 sheet were investigated by chemical mechanical polishing (CMP). The results revealed that, compared with the larger
                 spherical colloidal silica polishing particles, the smaller particle with brow-shaped were more beneficial to the polishing
                 of lead sheet. The influence of particle size and concentration of polishing particles on the polishing performance of pure
                 lead mainly depended on the coupling relationship among lead sheet surface, colloidal silica particles and the lint on


            Received 20 November 2019, revised 19 March 2020, accepted 1 April 2020, available online 28 September 2020.
            *Corresponding author. E-mail: yujiaxin@swust.edu.cn, Tel: +86-816-6089685.
            The project was supported by the National Natural Science Foundation of China (51975492, 51575462), the Science and Technology
            Research Fund of Sichuan Provincial Science and Technology Department, China (2018JY0245), the Scientific Research Fund of
            Sichuan Provincial Education Department, China (18ZA0504).
            国家自然科学基金项目(51975492,51575462),四川省科技厅重大前沿科学技术研究项目(2018JY0245)和四川省教育厅科研
            重点项目(18ZA0504)资助.
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