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真空与低温                                 第  31 卷    第  3 期
              336                                     Vacuum and Cryogenics                       2025 年 5 月



                         环  形   谐   振   式  传   感   器   及  其   真   空   气   体  阻   尼   特   性  研   究



                                        王呈祥,李青松,吴 锴,王鑫宇,肖定邦,吴学忠
                           (国防科技大学智能科学学院  湖南省                 MEMS   工程技术中心,长沙 410073)


                     摘要:环形谐振式传感器在不同压力下的阻尼损耗存在显著差异,可通过品质因数测量表征压力。介绍了
                  一种环形谐振式传感器,分析了其真空气体阻尼特性并验证了其用于压力测量的可行性。构建了环形谐振式传
                  感器的气体阻尼损耗模型,分析了品质因数损耗来源、谐振器结构尺寸对气体阻尼的影响,设计并加工了基于熔
                  融石英材料的环形谐振式传感器样机,进行了压力测量。测量结果表明,环形谐振式传感器线性测量范围为
                  0.1~130 Pa,分辨力优于  0.01 Pa。
                     关键词:环形谐振器;熔融石英;真空;气体阻尼
                     中图分类号:TB771                     文献标志码:A       文章编号:1006−7086(2025)03−0336−07
                     DOI:10.12446/j.issn.1006-7086.2025.03.007


                                 Vacuum Gas Damping Characteristics of the Ring Resonant Sensor

                           WANG Chengxiang,LI Qingsong,WU Kai,WANG Xinyu,XIAO Dingbang,WU Xuezhong
                                     (Hunan MEMS Research Center,College of Intelligence Science,
                                   National University of Defense Technology,Changsha 410073,China)

                     Abstract:In modern vacuum technology applications ranging from semiconductor manufacturing to aerospace systems,
                  precise pressure monitoring in the range of 0.1~1 000 Pa remains challenging for MEMS type vacuum gauges. Typically,
                  MEMS vacuum gauges are fabricated using monocrystalline silicon processing,which makes the sensors difficult to apply to
                  application scenarios containing fluoride ions. Fused silica is more resistant to fluoride ion etching than monocrystalline sili-
                  con and is compatible with the MEMS process,which is expected to be used in a new generation of high-performance sen-
                  sors. In this paper, a ring resonant sensor is fabricated using fused silica material to address the problem of silicon-based
                  MEMS vacuum sensors susceptible to fluoride ion etching. The difference in the damping loss of the ring sensor at different
                  vacuum pressures makes it possible to determine the vacuum pressure through quality factor measurements. The structure of
                  the ring resonator is described in detail,and the gas damping loss model of the sensor is established. Its vacuum gas damping
                  characteristics are analyzed,and the effects of quality factor loss sources and structural size differences on gas damping and
                  measurement range are thoroughly discussed. A resonant sensor based on fused silica material is designed and fabricated,and
                  the  feasibility  of  vacuum  pressure  measurement  is  demonstrated.  Measurement  results  show  that  the  linear  measurement
                  range of the ring resonant sensor is 0.1~130 Pa with a resolution better than 0.01 Pa.
                     Key words:ring resonator;fused silica;vacuum;gas damping



              0 引言                                              基于   MEMS   技术的微机械谐振压力传感器具有测
                                                                                                           −4
                                                                量精度高、长期稳定性好的优势,可实现                    1×10  Pa
                  基于微机电系统(MEMS,Micro-Electro-Mecha-
              nical Systems)技术的谐振式传感器可用于角速度                     到  101 kPa(大气压)范围内的测量覆盖,相比非电
              测量、加速度测量、压力测量等,具有体积小、功                            离型的    MEMS   型传感器,如电容薄膜真空计              [5-6] 、电
                                                                         [7]
              耗低、灵敏度高、价格低的优势,可满足仪器仪表                            阻真空计 、皮拉尼真空计             [8-9] ,具有更低的线性测
              微型化的发展需求,是仪器仪表研究的热点之一                      [1-4] 。  量下限,相比电离型的真空传感器,具有测量精度


              收稿日期:2024−12−26
              基金项目:自然科学基金区域创新发展联合基金(U21A201733)
              作者简介:王呈祥,博士。E-mail:wcx20120332@163.com
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