Page 4 - 《真空与低温》2025年第5期

第 31 卷 第 5 期 真空与低温
2025 年 9 月 Vacuum and Cryogenics 543

磁 控 溅 射 镀 膜 技 术 新 进 展

王福贞
（北京联合大学，北京 100102）

摘要：磁控溅射镀膜技术是当今制备高新技术产品中各种功能薄膜的重要技术。随着高新技术和高端制造
业的发展及人民生活水平的提高，磁控溅射镀膜技术面临更多样化的需求和更高的性能要求，推动磁控溅射镀膜
技术不断进步。介绍了磁控溅射镀膜技术的原理及特点，综述了磁控溅射靶、电源、镀膜工艺和应用等方面的研
究进展，评价了在工模具和耐磨零件等领域镀膜中的应用效果。
关键词：辉光放电；阴极溅射；平面磁控溅射靶；柱状磁控溅射靶；非平衡闭合磁场；高功率脉冲磁控溅射
中图分类号：TB79；TG174.444 文献标志码：A 文章编号：1006−7086（2025）05−0543−13
DOI：10.12446/j.issn.1006-7086.2025.05.001

Advances in Magnetron Sputtering Plating Technology

WANG Fuzhen
（Beijing Union University，Beijing 100102，China）

Abstract：Magnetron sputtering coating technology is a crucial technique for fabricating various functional thin films in
today's high-tech products. With the advancement of high technology，high-end manufacturing，and the improvement of liv-
ing standards，magnetron sputtering coating technology faces more diversified demands and higher performance requirements，
driving its continuous progress. This paper presents recent developments in magnetron sputtering coating technology，focus-
ing on the principles of unbalanced closed-field magnetron sputtering and its application effects in coating tools，molds，and
wear-resistant components. In an unbalanced magnetron sputtering target，the magnetic flux density between the outer and
central magnets is unevenly distributed，pushing the magnetic field intensity forward and expanding it outward，thereby ex-
tending the range of electron confinement by the magnetic field. When unbalanced magnetron sputtering targets
are installed in the coating chamber with opposite magnetic polarities arranged adjacently—where the outer mag-
netic poles of two targets are N-S and attract each other—the entire coating chamber’s magnetic fields interconnect to
form a closed field. This configuration confines electrons within the chamber to rotational motion，increasing collision proba-
bilities between electrons and argon gas or metal film atoms. Consequently，it enhances deposition rates，improves metal ion-
ization efficiency，facilitates compound film deposition，and elevates the overall performance of magnetron sputtering. The
planar unbalanced closed-field magnetron sputtering coating machine has successfully deposited CrN，WC hard coatings，and
DLC friction-reducing coatings on wear-resistant parts tempered at 200 °C，expanding the application range of hard coating
deposition. By employing the magnetron sputtering technology with rotating tubular columnar unbalanced closed-field targets，
where the magnetic polarities of adjacent columnar targets are arranged in opposite directions，a closed magnetic field is also
formed within the coating chamber. This enables the deposition of denser nano-multilayer films. In unbalanced magnetron
sputtering coating machines，matching the high-density electron flow emitted by arc discharge can further increase collision
probability for auxiliary deposition，thereby enhancing deposition rates and metal ionization rates. This results in high-hard-
ness，finer，and denser nano-multilayer films，which are expected to extend the service life of components operating in wear
and corrosion environments.The article also introduces several new technologies: using a medium-frequency power supply
matching with twin targets to overcome target poisoning and anode disappearance phenomena during the deposition of dielec-
tric films；adopting the “step-by-step deposition method” to avoid target poisoning and anode disappearance，thereby im-
proving deposition rates and film quality; employing hot cathode-enhanced magnetron sputtering technology to increase the

收稿日期：2025−02−26
作者简介：王福贞，教授。E-mail：15600548831@163.com